1.0SMB-AT中文資料國(guó)巨數(shù)據(jù)手冊(cè)PDF規(guī)格書

Features

■ For surface mounted applications in order to optimize board space

■ Low profile package

■ Built-in strain relief

■ Glass passivated junction

■ Low inductance

■ Excellent clamping capability

■ 1000W peak pulse power capability at 10/1000μs waveform,

repetition rate (duty cycle): 0.01%

■ Fast response time

■ Typical IR less than 1μA above 12V

■ High Temperature soldering: 260℃/10 seconds at terminals

■ Plastic package has underwriters laboratory flammability 94V-0

■ Meets MSL level 1, per J-STD-020

■ AEC-Q101 qualified

■ IEC61000-4-2 ESD 30KV Air, 30KV contact compliance

Mechanical Data

■ Case: JEDEC DO-214AA. Molded plastic over glass passivated junction

■ Terminal: Tin plated, solderable per MIL-STD-750, Method 2026

■ Polarity: Color band denotes cathode except bi-directional models

■ Standard Packaging: 12mm tape (EIA STD RS-481)

■ Weight: 0.10g

Applications

I/O interface ■ AC/DC power supply

Low frequency signal transmission line (RS232, RS485, etc.)