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7109DG

Channel style heat sink with folded back fins

Channelstyleheatsinkwithfoldedbackfinsforincreasedcoolingsurfacearea.Availablewithtinplatedsolderabletabsforeasyattachmenttotheprintedcircuitcard.

AAVID

Aavid, Thermal Division of Boyd Corporation

7109DG

Product Change Notification

AAVID

Aavid, Thermal Division of Boyd Corporation

7109DG

How to Use This Catalog

AAVID

Aavid, Thermal Division of Boyd Corporation

7109DG

包裝:卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶 類別:風(fēng)扇,熱管理 熱敏 - 散熱器 描述:TOP MOUNT HEATSINK .45\

AAVID

Aavid, Thermal Division of Boyd Corporation

7109DG/TR

Product Change Notification

AAVID

Aavid, Thermal Division of Boyd Corporation

7109DG/TRW/SPECLABEL

Product Change Notification

AAVID

Aavid, Thermal Division of Boyd Corporation

7109D-TRG

Channelstyleheatsinkwithfoldedbackfins

Channelstyleheatsinkwithfoldedbackfinsforincreasedcoolingsurfacearea.Availablewithtinplatedsolderabletabsforeasyattachmenttotheprintedcircuitcard.

AAVID

Aavid, Thermal Division of Boyd Corporation

7109-RC

CommonModeEMIChokes

SpecialFeatures ?Dualwinding ?Lowradiation ?Highcurrentcapacity ?Highinductance ?Dielectricstrength1000Vrms ?MountedonVW-1ratedheader ?FixedpinsforeasyPCBinsertion ?Operatingtemperature-55to+105°C

BournsBourns Electronic Solutions

伯恩斯

7109-RC

CommonModeEMIChokes

SpecialFeatures ?ReduceconductiveEMIemission ?Highcurrentcapacity ?Highimpedanceatlowfrequency ?Dielectricstrength3750Vrms ?CoilwoundonUL94V-0ratedplasticcasedferritecore ?Operatingtemperature-55to+105°C

BournsBourns Electronic Solutions

伯恩斯

7109-RC

CommonModeEMIChokes

SpecialFeatures ?ReduceconductiveEMIemission ?Highcurrentcapacity ?Highimpedanceatlowfrequency ?Dielectricstrength3750Vrms ?CoilwoundonUL94V-0ratedplasticcasedferritecore ?Operatingtemperature-55to+105°C

BournsBourns Electronic Solutions

伯恩斯

產(chǎn)品屬性

  • 產(chǎn)品編號:

    7109DG

  • 制造商:

    Aavid, Thermal Division of Boyd Corporation

  • 類別:

    風(fēng)扇,熱管理 > 熱敏 - 散熱器

  • 包裝:

    卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶

  • 類型:

    頂部安裝

  • 冷卻的封裝:

    TO-263(D2Pak)

  • 連接方法:

    SMD 基座

  • 形狀:

    矩形,鰭片

  • 長度:

    0.763"(19.38mm)

  • 寬度:

    1.000"(25.40mm)

  • 鰭片高度:

    0.450"(11.43mm)

  • 不同溫升時功率耗散:

    2.0W @ 30°C

  • 不同強制氣流時熱阻:

    3.00°C/W @ 300 LFM

  • 自然條件下熱阻:

    11.00°C/W

  • 材料:

  • 材料表面處理:

  • 描述:

    TOP MOUNT HEATSINK .45\

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更多7109DG供應(yīng)商 更新時間2025-1-25 16:06:00