零件編號(hào) | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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Marking:87330D;Package:VSON-CLIP;CSD87330Q3D Synchronous Buck NexFET? Power Block 1Features 1?Half-BridgePowerBlock ?Upto27-VVIN ?90%SystemEfficiencyat15A ?Upto20-AOperation ?High-FrequencyOperation(Upto1.5MHz) ?High-DensitySON3.3-mm×3.3-mmFootprint ?Optimizedfor5-VGateDrive ?Low-SwitchingLosses ?Ultra-LowInductancePackage ? | TI2Texas Instruments 德州儀器美國德州儀器公司 | TI2 | ||
Marking:87330D;Package:VSON-CLIP;CSD87330Q3D Synchronous Buck NexFET? Power Block 1Features 1?Half-BridgePowerBlock ?Upto27-VVIN ?90%SystemEfficiencyat15A ?Upto20-AOperation ?High-FrequencyOperation(Upto1.5MHz) ?High-DensitySON3.3-mm×3.3-mmFootprint ?Optimizedfor5-VGateDrive ?Low-SwitchingLosses ?Ultra-LowInductancePackage ? | TI2Texas Instruments 德州儀器美國德州儀器公司 | TI2 | ||
Marking:87330D;Package:VSON-CLIP;CSD87330Q3D Synchronous Buck NexFET? Power Block 1Features 1?Half-BridgePowerBlock ?Upto27-VVIN ?90%SystemEfficiencyat15A ?Upto20-AOperation ?High-FrequencyOperation(Upto1.5MHz) ?High-DensitySON3.3-mm×3.3-mmFootprint ?Optimizedfor5-VGateDrive ?Low-SwitchingLosses ?Ultra-LowInductancePackage ? | TI2Texas Instruments 德州儀器美國德州儀器公司 | TI2 |
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