首頁 >ALR-7090-VPS>規(guī)格書列表
| 零件編號(hào) | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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PeripheralanalogICforaudiosignalprocessing ■Overview TheAN7090FHQisaonechipICofaudiosignalprocessinganalogcircuitforuseinvariousinformationsystemsincludingmicrocomputer. Small-sizingofsystemandlowpowerdissipationarepossible. ■Features ?Built-inheadphoneamplifier ?Built-inexternal/internalmicrophone | PanasonicPanasonic Semiconductor 松下松下電器 | Panasonic | ||
PeripheralanalogICforaudiosignalprocessing ■Overview TheAN7090FHQisaonechipICofaudiosignalprocessinganalogcircuitforuseinvariousinformationsystemsincludingmicrocomputer. Small-sizingofsystemandlowpowerdissipationarepossible. ■Features ?Built-inheadphoneamplifier ?Built-inexternal/internalmicrophone | PanasonicPanasonic Semiconductor 松下松下電器 | Panasonic | ||
PowerTransistorPNP-LowSaturationTransistorChip PROCESSDETAILS ??????? ProcessEPITAXIALPLANAR DieSize41.3x41.3MILS DieThickness9.0MILS BaseBondingPadArea9.5x9.2MILS EmitterBondingPadArea12.8x10.2MILS TopSideMetalizati | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTLOWVCE(SAT)PNPPOWERTRANSISTOR | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
PowerTransistorPNP-LowSaturationTransistorChip PROCESSDETAILS ??????? ProcessEPITAXIALPLANAR DieSize41.3x41.3MILS DieThickness9.0MILS BaseBondingPadArea9.5x9.2MILS EmitterBondingPadArea12.8x10.2MILS TopSideMetalizati | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTLOWVCESATPNPPOWERTRANSISTOR DESCRIPTION: TheCENTRALSEMICONDUCTORCMXT7090LisaLowVCE(SAT)PNPTransistorinasixleadPowerSOT-26surfacemountpackagedesignedforLANcards,motorcontrol,powermanagement,strobeflashunitsandDC-DCconvertersformobilesystems. MARKINGCODE:X709L | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTLOWVCE(SAT)PNPPOWERTRANSISTOR DESCRIPTION: TheCENTRALSEMICONDUCTORCXT7090LisaLowVCE(SAT)PNPTransistorinaPowerSOT-89surfacemountpackage,designedforDC-DCconvertersformobilesystemsandLANcards,motorcontrol,powermanagementandstrobeflashunits. MARKING:FULLPARTNUMBER | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
PowerTransistorPNP-LowSaturationTransistorChip PROCESSDETAILS ??????? ProcessEPITAXIALPLANAR DieSize41.3x41.3MILS DieThickness9.0MILS BaseBondingPadArea9.5x9.2MILS EmitterBondingPadArea12.8x10.2MILS TopSideMetalizati | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTDUAL,ISOLATEDLOWVCE(SAT)PNPSILICONPOWERTRANSISTORS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTLOWVCE(SAT)PNPSILICONPOWERTRANSISTO DESCRIPTION: TheCENTRALSEMICONDUCTORCZT7090LisaLowVCE(SAT)PNPTransistorinaspacesavingPowerSOT-223surfacemountpackage,designedforDC-DCconvertersformobilesystemsandLANcards,motorcontrol,powermanagementandstrobeflashunits. MARKING:FULLPARTNUMBER | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central |
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