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AN-90

74C Family Characteristics

INTRODUCTION Thepurposeofthis54C/74CFamilyCharacteristicsapplicationnoteistosetdown,inoneplace,allthosecharacteristicswhicharecommontothedevicesintheMM54C/MM74Clogicfamily.Thecharacteristicswhichcanbeconsideredtoapplyare: 1.Outputvoltage-currentcharacteri

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9008

The Use of QFETs in a Flyback Converter

Introduction Powersupplydesignersfacemanychallengesindesigningmoreefficientandcost-effectivepowersupplies.Efficiencyisamajorconsiderationindesigningswitchingpowersupplies.Manyfactorsinthedesignprocesssuchastheinputfiltercapacitance,transformercoregeometryand

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9032

SPM??TEST BOARD for use in Isolated Inverter GND

DIP-SmartPowerModuleTestBoardIV SPM?TESTBOARDforuseinIsolatedInverterGND(InterfaceusingOptocouplerswithTwoIsolatedPowerSupplies)

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9033

SPM??TEST BOARD for use in Isolated Inverter GND

SPM?TESTBOARDforuseinIsolatedInverterGND(InterfaceusingOptocouplerswithFiveIsolatedPowerSupplies)

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9037

8x8 MLP DriverMOS Packaging

INTRODUCTION TheFairchild8x8DriverMOSpackageisbasedonMoldedLeadlessPackaging(MLP)technology.Thistechnologyhasbeenincreasinglyusedinpackagingforpowerrelatedproductsduetoitslowpackageheight,excellentthermalperformancewithlargethermalpadsinthecenterofthepac

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9040

Power33 Packaging

INTRODUCTION TheFairchildPower33usesaflatleadedpackagetoachieveSO-8typeperformanceinaformfactorthatis70smaller.Thispackagingtechnologyhasbeenincreasinglyusedforpowerrelatedproductsduetoitslowpackageheight,andexcellentthermalperformanceforsize.Thisisla

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9046

Dual Power56 Packaging

INTRODUCTION TheFairchild?DualPower56packageisbasedonMoldedLeadlessPackaging(MLP)technology.Thistechnologyhasbeenincreasinglyusedinpackagingforpowerrelatedproductsduetoitslowpackageheight,excellentthermalperformancewithlargethermalpadsinthecenterofthepac

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9048

6x6 DriverMOS Packaging

INTRODUCTION TheFairchild6x6DriverMOSpackageisbasedonMoldedLeadlessPackaging(MLP)technology.Thistechnologyhasbeenincreasinglyusedinpackagingforpowerrelatedproductsduetoitslowpackageheight,excellentthermalperformancewithlargethermalpadsinthecenterofthepac

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9050

Power Loss Calculation

Introduction TheFDMF6704DrMOSMCM(MultiChipModule)producthasHSandLSFETsandagatedriverallcontainedwithinasinglemodule.ThedesignhasbeenoptimizedforSynchronousBuckapplications.TheswitchingandconductionlossofeachHSFET,LSFETandgatedriverarecriticalforsys

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

AN-9072

Smart Power Module Motion-SPM?

MountingGuidance ThisapplicationnoteshowstheelectricspacingandmountingguidanceofμMini-DIPSPM.

FairchildFairchild Semiconductor

仙童半導(dǎo)體飛兆/仙童半導(dǎo)體公司

詳細(xì)參數(shù)

  • 型號(hào)：

    AN-90

  • 制造商：

    FAIRCHILD

  • 制造商全稱：

    Fairchild Semiconductor

  • 功能描述：

    74C Family Characteristics

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FAIRCHILD
23+
NA
19960
只做進(jìn)口原裝,終端工廠免費(fèi)送樣
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NA
CAN
2303
專營(yíng)CAN鐵帽仔
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MAT
專業(yè)鐵帽
CAN10
67500
鐵帽原裝主營(yíng)-可開原型號(hào)增稅票
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23+
CAN
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
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23+
CAN
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
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ANALOGIX
23+
TQFP
50000
全新原裝正品現(xiàn)貨,支持訂貨
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ANALOGIX
23+
TQFP
5000
原廠授權(quán)代理,海外優(yōu)勢(shì)訂貨渠道?？商峁┐罅繋齑?詳
 詢價(jià)
ANALOGIX
23+
NA/
3360
原裝現(xiàn)貨,當(dāng)天可交貨,原型號(hào)開票
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ANALOGIX
24+
TQFP
110
原裝正品,歡迎來電咨詢!
 詢價(jià)
24+
DIP
69
詢價(jià)
更多AN-90供應(yīng)商 更新時(shí)間2025-1-24 17:09:00

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