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AU1FM-M3SLASHI中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書
AU1FM-M3SLASHI規(guī)格書詳情
? Low profile package
? Ideal for automated placement
? Glass passivated pellet chip junction
? Ultrafast recovery times for high frequency
? Low reverse current
? Meets MSL level 1, per J-STD-020;
LF maximum peak of 260 °C
? Wave and reflow solderable
? AEC-Q101 qualified
- Automotive ordering code: base P/NHM3
? Compatible to SOD-123W package case outline
