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BGD704

CATVamplifiermodule

DESCRIPTION Hybridamplifiermoduleoperatingatavoltagesupplyof24V(DC)encapsulatedinaSOT115Jpackage. FEATURES ?Excellentlinearity ?Extremelylownoise ?Siliconnitridepassivation ?Ruggedconstruction ?Goldmetallizationensuresexcellentreliability. APPLICATIONS ?CAT

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

BGD704

750MHz,20dBgainpowerdoubleramplifier

JMNICQuanzhou Jinmei Electronic Co.,Ltd.

錦美電子泉州錦美電子有限公司

BGD704N

CATVamplifiermodule

DESCRIPTION Hybridamplifiermoduleoperatingatavoltagesupplyof24V(DC)encapsulatedinaSOT115Jpackage. FEATURES ?Excellentlinearity ?Extremelylownoise ?Siliconnitridepassivation ?Ruggedconstruction ?Goldmetallizationensuresexcellentreliability. APPLICATIONS ?CAT

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

BL704

BL702/BL704/BL706ishighlyintegratedBLEandzigbeecombochipsetsforIoTapplications.

Features ?Wireless –2.4GHzRFtransceiver –Bluetooth?Specificationv5.0 –Bluetooth?LowEnergy1Mbpsand2Mbps –Bluetooth?LongRangeCoded500Kbps and125Kbps –Zigbee3.0,BaseDeviceBehavior,CoreStack R21,GreenPower –IEEE802.15.4MAC/PHY –SupportBLE/zigbeecoexistence

BOUFFALOALBBouffalo Lab Intelligent Technology Co., Ltd.

博流智能博流智能科技（南京）有限公司

BUL704

Highvoltagefast-switchingNPNPowerTransistor

Description ThedeviceismanufacturedusinghighvoltageMulti-EpitaxialPlanartechnologyforhighswitchingspeedsandmediumvoltagecapability. ItusesaCellularEmitterstructurewithplanaredgeterminationtoenhanceswitchingspeedswhilemaintainingthewideRBSOA. Generalfeatures

STMICROELECTRONICSSTMicroelectronics

意法半導體意法半導體集團

CL704

HERMETICALLYSEALEDTO-5CASE

[CLAIREX]

etc2List of Unclassifed Manufacturers

etc未分類制造商etc2未分類制造商

CL704L

HERMETICALLYSEALEDTO-5CASE

[CLAIREX]

etc2List of Unclassifed Manufacturers

etc未分類制造商etc2未分類制造商

CMC704

Ultralowphasejitter:0.5ps

RALTRONRaltron Electronics Corporation

拉隆

CP704

SmallSignalTransistorsNPN-AmpSwitchTransistorChip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize22x22MILS DieThickness9.0MILS BaseBondingPadArea3.7X3.7MILS EmitterBondingPadArea4.2X4.2MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-18,000?

CentralCentral Semiconductor Corp

美國中央半導體

CP704V

SmallSignalTransistorsPNP-HighVoltageTransistorChip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize22x22MILS DieThickness7.1MILS BaseBondingPadArea3.7x3.7MILS EmitterBondingPadArea4.2x4.2MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-18,000?

CentralCentral Semiconductor Corp

美國中央半導體

供應商型號品牌批號封裝庫存備注價格
ROHM/羅姆
23+
TO-92
9264
原廠授權(quán)代理,海外優(yōu)勢訂貨渠道?？商峁┐罅繋齑?詳
 詢價
ROHM/羅姆
25+
IC
880000
明嘉萊只做原裝正品現(xiàn)貨
 詢價
ROHM
23+
ZIP
5177
現(xiàn)貨
 詢價
ROHM
24+
SIP
21322
公司原廠原裝現(xiàn)貨假一罰十!特價出售!強勢庫存!
 詢價
ROHM
24+
SIP
36500
原裝現(xiàn)貨/放心購買
 詢價
ROHM
23+
SIP
7300
專注配單,只做原裝進口現(xiàn)貨
 詢價
ROHM
2025+
ZIP
4865
全新原廠原裝產(chǎn)品、公司現(xiàn)貨銷售
 詢價
ROHM
23+
SIP
7300
專注配單,只做原裝進口現(xiàn)貨
 詢價
ROHM
24+
1199
詢價
ROHM
23+
DIP
12335
詢價
更多BA704-R供應商 更新時間2025-3-20 9:29:00

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