DKF110PFW1STES中文資料富士通數(shù)據(jù)手冊PDF規(guī)格書

Overview

The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate of a capacitor and the contacting finger acts as the second plate. A passivation layer on the device surface forms the dielectric between these two plates. Ridges and valleys on the finger yield varying capacitor values across the array, which is read to form an image of the fingerprint.

The MBF110 is manufactured in standard CMOS technology and is available in an 80-pin, VSPA 80/1 and LQFP 80/1. The 300 × 300 sensor array has a 50 μm pitch and yields a 500-dpi image. The sensor surface is protected by a patented, ultra-hard, abrasion and chemical resistant coating.

Features

? Non-optical solid-state device

? 300 × 300 sensor array, 50 μm pitch

? 1.5 cm × 1.5 cm sensor area

? 500-dpi resolution

? Operation from 3V to 5.5V

? Ultra-hard protective coating

? Integrated 8-bit flash analog-to-digital converter

? 8-bit microprocessor interface

? Standard CMOS technology

? Low power, less than 200 mW

Applications

? Database and network access

? Portable fingerprint acquisition

? Access control (home, auto, office, etc.)

? ATM

? Smart cards

? Cellular phone security access