首頁 >ECM32T-221K>規(guī)格書列表
| 零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
SMDFerriteChipInductors | ECM ECM Electronics Limited. | ECM | ||
SMDFerriteChipInductors | ECM ECM Electronics Limited. | ECM | ||
InductorsforDecouplingCircuits | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
SMDInductorsForPowerLine InductorsforDecouplingCircuitsWound/ForCurrent NLCVSeriesNLCV32 FEATURES ?ThisisarenewedversionofNLC322522. ?Theproducthasgoodheatdurabilitythatwithstandslead-freecompatiblereflowsolderingconditions. ?Lead-freematerialisusedfortheplatingontheterminal ?Th | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
InductorsforDecouplingCircuits InductorsforDecouplingCircuitsWound/ForCurrent NLCVSeriesNLCV32 FEATURES ?ThisisarenewedversionofNLC322522. ?Theproducthasgoodheatdurabilitythatwithstandslead-freecompatiblereflowsolderingconditions. ?Lead-freematerialisusedfortheplatingontheterminal ?Th | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
InductorsforDecouplingCircuitsWoundFerrite InductorsforDecouplingCircuitsWound/ForCurrent NLCVSeriesNLCV32 FEATURES ?ThisisarenewedversionofNLC322522. ?Theproducthasgoodheatdurabilitythatwithstandslead-freecompatiblereflowsolderingconditions. ?Lead-freematerialisusedfortheplatingontheterminal ?Th | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
SMD/SMTInductors(Coils) | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
InductorsforDecouplingCircuits InductorsforDecouplingCircuitsWound/ForCurrent NLCVSeriesNLCV32 FEATURES ?ThisisarenewedversionofNLC322522. ?Theproducthasgoodheatdurabilitythatwithstandslead-freecompatiblereflowsolderingconditions. ?Lead-freematerialisusedfortheplatingontheterminal ?Th | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
Inductors(Coils) | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK | ||
InductorsforDecouplingCircuitsWoundFerrite OverviewoftheNLFVSeries FEATURES ○Resinmoldtypewoundinductorfordecouplingcircuits. ○Magneticshieldtypecontainingferritepowderintheexteriormoldresin. APPLICATION Smartmeters,AVequipment,xDSL,electronicdevicesforcommunicationsinfrastructuresuchasmobilebas | TDKTDK Corporation TDK株式會(huì)社東電化（中國(guó)）投資有限公司 | TDK |
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