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EF-8000GL中文資料ETC數(shù)據(jù)手冊PDF規(guī)格書

EF-8000GL
廠商型號(hào)

EF-8000GL

功能描述

Low Rosin, Pb-Free/Sn-Pb Capable Wave Flux

文件大小

204.75 Kbytes

頁面數(shù)量

4

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企業(yè)簡稱

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中文名稱

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更新時(shí)間

2025-1-26 16:30:00

EF-8000GL規(guī)格書詳情

ALPHA EF-8000 GL is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFP’s with 144-168 leads as well as superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.

Features for Pb-Free

?Good hole-fill demonstrated by >96 yield on 10 mil holes.

?Low bridging performance on connectors.

?Good micro-solder ball performance in Lead-Free applications

?Pin testable

?Specifically designed for use on Cu-OSP PCBs

Benefits:

?Excellent Lead-Free soldering performance on various board finishes.

?Evenly spread, tack free residue.

?Capable for high density as well as general purpose Lead-Free soldering processes.

?Can be used in Pb free or Sn/Pb processes

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