HBN808中文資料桑德斯微電子數(shù)據(jù)手冊(cè)PDF規(guī)格書

Features

? Surface mount bridge, small package;

? Ideal for printed circuit boards;

? Glass passivated chip junction;

? High forward current capability up to 8.0A;

? High surge current capability;

? High heat dissipation capability;

? Low profile package;

? Low forward voltage drop;

? Plastic package has Underwrites LaboratoryFlammability Classification 94V-0

? This is a Pb ? Free Device

? All SMC parts are traceable to the wafer lot

? Additional testing can be offered upon request

Mechanical Data

? Case: HBS;

? Epoxy meets UL-94V-0 Flammability rating;

? Terminals:Matte tin plated leads, solderableper

J-STD-002 and JESD22-B102;

? High temperature soldering guaranteed:

Solder Reflow 260℃,10seconds;

? Polarity: As marked on body;

? Marking: Type number;