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HBS808中文資料桑德斯微電子數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

HBS808
廠商型號(hào)

HBS808

功能描述

Glass Passivated Single-Phase 8.0Amp Surface Mount Bridge Rectifier

文件大小

718.96 Kbytes

頁(yè)面數(shù)量

5 頁(yè)

生產(chǎn)廠商 SMC Diode Solutions Co. LTD
企業(yè)簡(jiǎn)稱(chēng)

SMCDIODE桑德斯微電子

中文名稱(chēng)

桑德斯微電子器件(南京)有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-1-27 11:32:00

HBS808規(guī)格書(shū)詳情

Features

? Surface mount bridge, small package;

? Ideal for printed circuit boards;

? Glass passivated chip junction;

? High forward current capability up to 8.0A;

? High surge current capability;

? High heat dissipation capability;

? Low profile package;

? Low forward voltage drop;

? Plastic package has Underwrites LaboratoryFlammability Classification 94V-0

? This is a Pb ? Free Device

? All SMC parts are traceable to the wafer lot

? Additional testing can be offered upon request

Mechanical Data

? Case: HBS;

? Epoxy meets UL-94V-0 Flammability rating;

? Terminals:Matte tin plated leads, solderableper

J-STD-002 and JESD22-B102;

? High temperature soldering guaranteed:

Solder Reflow 260℃,10seconds;

? Polarity: As marked on body;

? Marking: Type number;

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
POWER
2022+
QFP
57550
詢(xún)價(jià)
HORNBY
23+
10000
原廠授權(quán)一級(jí)代理,專(zhuān)業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種
詢(xún)價(jià)
INTEL
19+
QFP64
256800
原廠代理渠道,每一顆芯片都可追溯原廠;
詢(xún)價(jià)
24+
N/A
51000
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
詢(xún)價(jià)
WIER(海威爾)
2112+
SIP4
105000
44個(gè)/管一級(jí)代理專(zhuān)營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期
詢(xún)價(jià)
POWER
23+
QFP
6000
專(zhuān)注配單,只做原裝進(jìn)口現(xiàn)貨
詢(xún)價(jià)
INTEL
22+
QFP64
3255
全新原裝正品 現(xiàn)貨 假一罰十
詢(xún)價(jià)
POWER-ONE
24+
DIP
5
詢(xún)價(jià)
INTEL
05+
原廠原裝
5181
只做全新原裝真實(shí)現(xiàn)貨供應(yīng)
詢(xún)價(jià)
POWER-ONE
22+
DIP
5000
進(jìn)口原裝!現(xiàn)貨庫(kù)存
詢(xún)價(jià)