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K4T1G084QQ-HCE6中文資料三星數(shù)據(jù)手冊PDF規(guī)格書

K4T1G084QQ-HCE6
廠商型號

K4T1G084QQ-HCE6

功能描述

1Gb Q-die DDR2 SDRAM Specification

文件大小

886.4 Kbytes

頁面數(shù)量

44

生產(chǎn)廠商 Samsung semiconductor
企業(yè)簡稱

Samsung三星

中文名稱

三星半導(dǎo)體官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-2-21 14:20:00

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K4T1G084QQ-HCE6規(guī)格書詳情

The 1Gb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for general applications.

Key Features

? JEDEC standard 1.8V ± 0.1V Power Supply

? VDDQ = 1.8V ± 0.1V

? 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin

? 8 Banks

? Posted CAS

? Programmable CAS Latency: 3, 4, 5, 6

? Programmable Additive Latency: 0, 1, 2, 3, 4, 5

? Write Latency(WL) = Read Latency(RL) -1

? Burst Length: 4 , 8(Interleave/nibble sequential)

? Programmable Sequential / Interleave Burst Mode

? Bi-directional Differential Data-Strobe (Single-ended data strobe is an optional feature)

? Off-Chip Driver(OCD) Impedance Adjustment

? On Die Termination

? Special Function Support

- PASR(Partial Array Self Refresh)

- 50ohm ODT

- High Temperature Self-Refresh rate enable

? Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C

? All of Lead-free products are compliant for RoHS

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
SAMSUNG/三星
23+
BGA
98900
原廠原裝正品現(xiàn)貨!!
詢價
SAMSUNG/三星
22+
FBGA
15330
原裝正品
詢價
SAMSUNG
2020+
FBGA60
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價
SEC
24+
BGA
3000
進(jìn)口原裝正品優(yōu)勢供應(yīng)
詢價
SAMSUNG
存儲器
BGA
40328
SAMSUNG原裝存儲芯片-誠信為本
詢價
SAMSUNG
23+
TSSOP
65480
詢價
Samsung
2020+
DDR2128Mx8PC667Le
3850
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可
詢價
SAMSUNG
08+
BGA
58
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
詢價
SAMSUNG
23+
BGA
8560
受權(quán)代理!全新原裝現(xiàn)貨特價熱賣!
詢價
SAMSUNG
22+23+
FBGA
8000
新到現(xiàn)貨,只做原裝進(jìn)口
詢價