LTM4681集成電路（IC）的電源管理-專用規(guī)格書PDF中文資料

LTM4681屬于集成電路（IC）的電源管理-專用。由亞德諾半導(dǎo)體技術(shù)有限公司制造生產(chǎn)的LTM4681電源管理 - 專用專用型電源管理集成電路 (PMIC) 用于電源的控制或操作，適合特定或小范圍的目標(biāo)應(yīng)用，例如汽車氣囊管理、電容器組平衡、AC 公共電力監(jiān)控、存儲器總線端接、接地故障檢測、能量收集、小型引擎管理、處理器或芯片集專用電壓調(diào)節(jié)、負(fù)載突降保護(hù)、觸覺驅(qū)動器、熱電制冷器控制等。

DESCRIPTION

The LTM?4660 is a complete 300W output switching

mode hybrid-topology step-down DC/DC μModule?

micromodule) nonisolated bus converter. Its exposed

power inductor resides on the top of the package, providing

an intrinsic path for heat to dissipate up and out

of the module—away from one’s printed circuit board.

Included in the package are the switching controller IC,

power MOSFETs and supporting components. Only flying

charge-pump) capacitors, bulk input and output bypass

capacitors, and a few configuration passives are needed.

The LTM4660 features frequency synchronization,

Burst Mode? operation and output voltage soft-start and

tracking. An onboard temperature diode is available for

temperature monitoring. The LTM4660 protects against

short-circuit, overcurrent, and overtemperature faults. For

higher power applications, multiple LTM4660 modules

can be easily paralleled.

The LTM4660 is offered in a 16mm × 16mm × 10.34mm

BGA package with RoHS compliant terminal finish.

FEATURES

- Input Voltage Range: 30V to 60V (65V Abs. Max.)

- Wide Output Voltage: 4.5V to 18V (VOUT < VIN/2)

- 97.3 Peak Efficiency (12VOUT at 15A, 48VIN)

- ±1.5 Maximum Total DC Output Error

- Up to 300W Output Power

- Scalable: Parallel LTM4660s for Higher Power

- Fixed Frequency Current Mode Control

- Phase-Lockable External Synchronization from 200kHz to 1MHz

- Low Start-Up Inrush Current with Flying Capacitor

Voltage-Balancing Prior to DC/DC Switching Action

- Output Voltage Tracking with Soft-Start

- Short-Circuit Protection with Adjustable Retry-Timer

- Overcurrent and Overtemperature Protection

- Onboard Diode Temperature Monitor

- Optional External Reference Input

- Power Good and FAULT Indicators

- 16mm × 16mm × 10.34mm BGA Package

APPLICATIONS

- Telecom, Data Centers and Networking Equipment

- Industrial and Test Equipment