W25Q16CVSNAP中文資料華邦電子數(shù)據(jù)手冊PDF規(guī)格書

GENERAL DESCRIPTION

The W25Q16CV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1μA for power-down.

FEATURES

? Family of SpiFlash Memories

– W25Q16CV: 16M-bit / 2M-byte (2,097,152)

– 256-byte per programmable page

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

? Highest Performance Serial Flash

– 104MHz Dual SPI / Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 52MB/S continuous data transfer rate

– Up to 8X that of ordinary Serial Flash

– More than 100,000 erase/program cycles(1)

– More than 20-year data retention

? Efficient “Continuous Read Mode”

– Low Instruction overhead

– Continuous Read with 8/16/32/64-Byte Wrap

– As few as 8 clocks to address memory

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

? Low Power, Wide Temperature Range

– Single 2.7 to 3.6V supply

– 4mA active current, <1μA Power-down (typ.)

– -40°C to +85°C operating range

? Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4/32/64K-bytes)

– Program one to 256 bytes

– Erase/Program Suspend & Resume

? Advanced Security & Identification Features

– Software and Hardware Write-Protect

– Top/Bottom, 4KB complement array protection

– Power Supply Lock-Down and OTP protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Byte Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits

? Space Efficient Packaging

– 8-pin SOIC 150(2)/208-mil

– 8-pad WSON 6x5-mm

– 8-pin PDIP 300-mil(2)

– 16-pin SOIC 300-mil(2)

– 24-ball TFBGA 8x6-mm

– Contact Winbond for KGD and other options